Add To Favorites
Product Overview
Digi-Key Part Number BER169-ND
Quantity Available 34,879
Can ship immediately
Manufacturer

Manufacturer Part Number

HF115AC-0.0055-AC-90

Description Thermal Pad Gray 21.84mm x 18.79mm Rectangle Adhesive - One Side
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 2 Weeks
Documents & Media
Datasheets Hi-Flow 115-AC
Other Related Documents Sil-Pad Metric Configurations
RoHS Information Hi-Flow 115-AC Material Report
PCN Packaging Henkel/Berquist Revised Brands 10/May/2016
Product Attributes Select All
Category

Fans, Thermal Management

Family

Thermal - Pads, Sheets

Manufacturer

Bergquist

Series Hi-Flow® 115-AC
Part Status Active
Usage TO-218, TO-220, TO-247
Shape Rectangle
Outline 21.84mm x 18.79mm
Thickness 0.0055" (0.140mm)
Material Phase Change Compound
Adhesive Adhesive - One Side
Backing, Carrier Fiberglass
Color Gray
Thermal Resistivity 0.35°C/W
Thermal Conductivity 0.8 W/m-K
 
You May Also Be Interested In
Additional Resources
Standard Package ? 100
Other Names BER169
BG428814
HF115AC-90
HF115AC00055AC90
HF115TAAC-90

22:29:06 12/8/2016

Price & Procurement
 

Quantity
All prices are in ILS.
Price Break Unit Price Extended Price
1 0.42000 0.42
10 0.36700 3.67
50 0.32900 16.45
100 0.29110 29.11
500 0.25310 126.55
1,000 0.18982 189.82
5,000 0.16451 822.57

Submit a request for quotation on quantities greater than those displayed.

Send Feedback