Power Driver Modules

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Configuration	Current	Voltage	Voltage - Isolation	Grade	Qualification	Mounting Type	Package / Case

LMG3522R030RQSR 650-V 30-M GAN FET WITH INTEGRAT Texas Instruments	1,639 In Stock	1 : ₪106.19000 Cut Tape (CT) 2,000 : ₪53.17082 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	MOSFET	Half Bridge Inverter	55 A	650 V	-	-	-	Surface Mount	52-VQFN Exposed Pad
LMG3522R030QRQSTQ1 AUTOMOTIVE 650-V 30-M GAN FET WI Texas Instruments	250 In Stock	1 : ₪145.90000 Cut Tape (CT) 250 : ₪100.65808 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	MOSFET	Half Bridge Inverter	55 A	650 V	-	Automotive	AEC-Q100	Surface Mount, Wettable Flank	52-VQFN Exposed Pad
LMG3526R030RQST 650-V 30-M GAN FET WITH INTEGRAT Texas Instruments	250 In Stock	1 : ₪129.73000 Cut Tape (CT) 250 : ₪97.47580 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	MOSFET	Half Bridge Inverter	55 A	650 V	-	-	-	Surface Mount, Wettable Flank	52-VQFN Exposed Pad
LMG3526R030RQSR 650-V 30-M GAN FET WITH INTEGRAT Texas Instruments	1,819 In Stock	1 : ₪113.31000 Cut Tape (CT) 2,000 : ₪75.08087 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	MOSFET	Half Bridge Inverter	55 A	650 V	-	-	-	Surface Mount, Wettable Flank	52-VQFN Exposed Pad
LMG3522R030RQST 650-V 30-M GAN FET WITH INTEGRAT Texas Instruments	563 In Stock	1 : ₪121.66000 Cut Tape (CT) 250 : ₪83.01008 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Obsolete	MOSFET	Half Bridge Inverter	55 A	650 V	-	-	-	Surface Mount	52-VQFN Exposed Pad
LMG3522R030QRQSRQ1 AUTOMOTIVE 650-V 30-M GAN FET WI Texas Instruments	0 In Stock Check Lead Time	2,000 : ₪63.62157 Tape & Reel (TR)	-	Tape & Reel (TR)	Active	MOSFET	Half Bridge Inverter	55 A	650 V	-	Automotive	AEC-Q100	Surface Mount, Wettable Flank	52-VQFN Exposed Pad

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Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.