Tflex™ 200 V0 Series

Soft, free standing gap filler from Laird Thermal

Image of Laird Technologies - Thermal Products' Tflex™ 200 V0 SeriesLaird Thermal's Tflex 200 V0s are a series of soft, free standing gap filler that are more compressible than most gap fillers. Tflex 200 V0 combines good thermal conductivity of 1.1 W/mK with high conformability to produce low thermal resistance. The alumina filler allows Tflex 200 V0 to remain a cost effective solution where moderate thermal performance is acceptable. Tflex 200 V0 is naturally tacky and does not need an additional adhesive coating that can inhibit thermal performance. Tflex 200  V0 is electrically insulating, stable from -40°C to 160°C and meets the UL 94 V0 rating.

Features
  • Soft and compressible for low stress applications
  • Naturally tacky needing no further adhesive coating
  • 1.1 W/mK thermal conductivity
  • Available in thicknesses from 0.010" (0.25 mm) to 0.200" (5.0 mm)
Applications
  • Cooling component to the chassis or frame
  • High speed mass storage drives
  • RDRAM memory modules
  • Heat pipe thermal solutions
  • Automotive engine control units

Tflex 200 V0 Series

ImageManufacturer Part NumberDescriptionAvailable QuantityPrice
THERM PAD 228.6MMX228.6MM GRAYA14162-25THERM PAD 228.6MMX228.6MM GRAY0 - ImmediateSee Page for PricingView Details
THERM PAD 228.6MMX228.6MM GRAYA14162-27THERM PAD 228.6MMX228.6MM GRAY0 - ImmediateSee Page for PricingView Details
THERM PAD 228.6MMX228.6MM GRAYA14162-06THERM PAD 228.6MMX228.6MM GRAY0 - ImmediateSee Page for PricingView Details
THERM PAD 228.6MMX228.6MM GRAYA14162-15THERM PAD 228.6MMX228.6MM GRAY0 - ImmediateSee Page for PricingView Details
THERM PAD 228.6MMX228.6MM GRAYA14162-33THERM PAD 228.6MMX228.6MM GRAY0 - ImmediateSee Page for PricingView Details
Published: 2012-06-29