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374324B00035G | |
|---|---|
DigiKey Part Number | HS318-ND |
Manufacturer | |
Manufacturer Product Number | 374324B00035G |
Description | HEATSINK BGA W/ADHESIVE TAPE |
Manufacturer Standard Lead Time | 14 Weeks |
Customer Reference | |
Detailed Description | Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level |
Datasheet | Datasheet |
Product Attributes
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Category | Length 1.063" (27.00mm) |
Mfr | Width 1.063" (27.00mm) |
Series | Fin Height 0.394" (10.00mm) |
Packaging Box | Power Dissipation @ Temperature Rise 3.0W @ 90°C |
Part Status Active | Thermal Resistance @ Forced Air Flow 9.30°C/W @ 200 LFM |
Type Board Level | Thermal Resistance @ Natural 30.60°C/W |
Package Cooled | Material |
Attachment Method Thermal Tape, Adhesive (Included) | Material Finish Black Anodized |
Shape Square, Pin Fins | Base Product Number |
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In-Stock: 2,483
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Quantity
All prices are in ILS
Box
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | ₪8.69000 | ₪8.69 |
| 10 | ₪7.68300 | ₪76.83 |
| 25 | ₪7.31800 | ₪182.95 |
| 50 | ₪7.05440 | ₪352.72 |
| 100 | ₪6.79970 | ₪679.97 |
| 250 | ₪6.47640 | ₪1,619.10 |
| 756 | ₪6.10623 | ₪4,616.31 |
| 1,512 | ₪5.88488 | ₪8,897.94 |
| 5,292 | ₪5.50436 | ₪29,129.07 |
| Unit Price without VAT: | ₪8.69000 |
|---|---|
| Unit Price with VAT: | ₪10.25420 |
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