With a thermal simulator it is possible to see the distribution of the surface temperature on the heatsink and CPU. The highest temperature is seen directly at the contact area between the CPU and heatsink. The heat is transported inside the heatsink material via conduction and from the surfaces to the air via convective heat transfer. Depending on the balance between conduction and convection, a temperature profile inside the heatsink material is observed. As the cooling air from the fan does not provide a uniform flow pattern, there are regions in the heatsink which show a remarkable temperature field. This information provided by the thermal simulator can reveal exactly what computer cooling measures should be taken for optimal results. In general, if high temperature gradients are observed in heatsinks, the conduction effect is subject to improvement. This can be done by choosing another material (alloy) with better conductivity or larger cross sections for the heat conduction mechanism.