This graphic shows the potential air gaps that exist between the device and the heatsink, which were covered in the previous slide. These gaps must be controlled by using the correct interface material. When both a heatsink and device are both flat and smooth, a thin TIM such as grease or phase change may be used. If the devices are not coplanar by a large amount, a gap filler material may be a better choice.
 
                 
                 
                 
 
 
 
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