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Thermal resistance is the product of both thermal impedance and contact area. It relates the performance of a TIM to an actual application, such as a 30mm BGA. The units of thermal resistance is °C/W, or the temperature rise from the component to the heat sink, divided by the power dissipated by the heat sink. As shown by the above graph, TIM performance is critical on smaller components.
PTM Published on: 2011-10-13
Israel