The maxiGRIP is a patented attachment system for mounting heat sinks to BGAs, flip-chips and other hot PCB components, without the need to drill holes in the board. The maxiGRIP system features a plastic frame clip that snaps securely about a component’s perimeter. A stainless steel spring clip runs through the heat sink’s fin field and fastens securely to the plastic frame. As a result, the sink is mounted securely to the component with steady, even pressure. Both the spring clip and frame clip can be easily removed, allowing the heat sink to be detached and re-attached without damaging the device, surrounding components or the board. Heat sinks with maxiGRIP come with high-performance phase-changing, thermal interface material.