1168-2098-ND

TG-NSP35 Non-Silicone Putty Materials

T-Global Technology

T-Global TG-NSP35 is a one part, fully cured, non-silicone thermal putty with a thermal conductivity allowing it to address most of the common thermal issues facing the automotive industry.

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Related Product Highlight

ממלא מרווחים נוזלי תרמי, מרכיב-אחד, NSP-35 ה- NSP-35 הוא ממלא מרווחים לא-סיליקוני מרכיב-אחד עם אשפרה מלאה מבית T-Global.

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