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Cinch Connectivity Solutions CIN:APSE Solderless, High Density, Custom Interconnects

CIN::APSE solderless, high density, custom interconnects are used for board to board, IC to board, flex to board and component to board applications for Military, Aerospace, Datacom, Satellite and Test Equipment.

12/28/2020 2:12:58 PM

Part List

תמונהמק"ט יצרןתיאורכמות זמינהמחירהצגת הפרטים
CONN SPRING MOD 25POS SMD3800520001CONN SPRING MOD 25POS SMDמיידית - 35$322.03הצגת הפרטים
CONN SPRING MOD 51POS SMD3800520013CONN SPRING MOD 51POS SMDמיידית - 0$339.32הצגת הפרטים