Henkel LOCTITE® Bergquist®

Gap Pad® TGP 6000ULM

Bergquist’s Gap Pad TGP 6000ULM is designed for applications where high heat dissipation and low stress are required

Image of Bergquist's Gap Pad® TGP 6000ULM Bergquist’s Gap Pad TGP 6000ULM offers high thermal conductivity of 6.0 W/m∙K and an ultra-low modulus for reduced stress, particularly for small footprint components with high power density. The silicone-based, nonelectrically conductive Gap Pad is highly conformable, providing excellent coverage on various topographies. Bergquist Gap Pad TGP 6000 ULM is easy to apply and reworkable, as the material provides a low- and a high-tack side and is available in custom-cut shapes for specific device and application requirements.

Features and Benefits
  • Outstanding thermal performance
  • Very low stress
  • Ease of handling
  • High-tack and low-tack sides
  • Reworkable
  • Excellent wet-out characteristics
  • High dielectric strength
Applications
  • Telecommunications
  • ASICs
  • DSPs
  • Consumer electronics
  • Thermal modules to heat sinks assembly

Gap Pad® TGP 6000ULM

תמונהמק"ט יצרןתיאורכמות זמינהמחירהצגת הפרטים
THERM PAD 406.4X203.2MM GRAYGPTGP6000ULM-0.040-12-0816THERM PAD 406.4X203.2MM GRAYמיידית - 39$585.05הצגת הפרטים
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THERM PAD 406.4X203.2MM GRAYGPTGP6000ULM-0.060-12-0816THERM PAD 406.4X203.2MM GRAYמיידית - 0$754.51הצגת הפרטים
THERM PAD 406.4X203.2MM GRAY2407938THERM PAD 406.4X203.2MM GRAYמיידית - 0See Page for Pricingהצגת הפרטים
2020-04-16 תאריך הפרסום