Gap Pad® TGP 7000ULM

Bergquist’s Gap Pad TGP 7000ULM is an extremely soft gap-filling material rated at a thermal conductivity of 7.0 W/m-K that is specially formulated for high-performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra-low modulus resin formulation.

Gap Pad TGP 7000ULM is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.