TC3 Ultra Max™ Thermal Compound

Chip Quik's TC3 Ultra Max thermal compound series is available in three convenient sizes: 1 g/1 cc syringe, 3.5 g/3 cc syringe, and 10 g/3 cc syringe. The TC3 achieves thermal conductivity of 8.5 W/mK, allowing ICs to handle higher power loads while staying cooler with generated heat more efficiently transferred to the heat sink. The TC3 is electrically insulating, with an electrical volume resistivity of 4 x 10¹³ ohm-cm.

TC3 Ultra Max is heavily filled with heat conductive metal oxide creating a high-density thermal compound with 2.5 g/cc density. It is non-curing and non-flowing with low bleed and high-temperature stability. This thermal compound is lead-free, RoHS, and REACH compliant.