NP545 Solder Paste

            NP545 Solder Paste
                    Kester's no-clean, zero-halogen solder paste formula is designed for consistency and repeatability
    

Kester's NP545 is a no-clean, zero-halogen solder paste formula designed for consistency and repeatability. The NP545 consistently delivers paste transfer efficiencies of 0.55 AR to 0.50 AR. This paste is also fully capable of printing and reflowing 01005 components, even in air reflow, with minimal gapping behavior. NP545 is classified as ROL0 per IPC J-STD-004B.

The NP545 is available in lead-free and leaded alloys. The leaded alloy can be used in backward applications and is thus fully compatible for soldering complex lead-free component on SnPb assemblies.

Features

Leaded and lead-free

ROL0 per J-STD-004B
Zero-halogen (none intentionally added)
Consistent print performance to 0.50 AR
Excellent cosmetics and a clear residue
Reflowable in air and nitrogen conditions
Residue is pin-probable

Leaded

No-clean SMT soldering process
Backward soldering with lead-free components
Fully compatible for soldering complex, lead-free components on SnPb assemblies

Lead-free

Excellent shelf-life: one year in both refrigerated and room temperature
Wide reflow profile window with good solderability
Exceptional printing reflow performance across a wide range of print and reflow process conditions
Room temperature storage stability makes it excellent for a low-volume/high-mix type of manufacturing
Low QFN/BGA voiding