BG Series Thermal Heatsinks for BGA, CPU, and GPU

Ohmite’s low-cost BG series thermal heatsinks are designed for central processing units (CPU), graphic processing units (GPU), ball grid arrays (BGA), and plastic ball grid arrays (PBGA) devices. These simple heatsinks can be attached to devices with adhesive thermal tape included with the heatsink kits. The BG series heatsinks have a black anodized surface finish and they can be used in either natural (free) or forced convection cooling applications. Custom heatsinks are available upon request.