SiC MOSFETs in a TO-Leadless (TOLL) Package

ROHM SiC MOSFETs in a compact TOLL package deliver superior performance in high-power applications. Compared to conventional TO-263 packages, the TOLL form factor reduces footprint space by approximately 26% while enabling excellent heat dissipation and high-current capability. Its low gate resistance minimizes switching losses, lowering overall power consumption and boosting efficiency. With a low-profile design that is ideal for modern slim power supplies, these devices are optimized for demanding applications such as server power supplies, PV inverters, and other next-generation industrial power solutions.