LH351B LED Series

Samsung's LH351B is built using high technology manufacturing processes and consists of cutting edge materials. To simplify the manufacturing process and reduce forward voltage level, the LH351B is comprised of a flip-chip solution and, to increase ability of color binning supply (MacAdam - 3-step yield), film phosphor technology is adopted. The package structure uses reflective material that could help to reduce yellow ring phenomenon. LH351B is mounted on a ceramic substrate, which features fast heat transfer characteristics, reliability, design freedom of the electrical pad space, and dielectric behavior, and has a small form factor with 1 W to 5 W operation.