VS-MPY038P120/VS-MPX075P120 MAACPAK PressFit Power Modules

Vishay Intertechnology introduces two 1200 V MOSFET power modules designed to increased efficiency and reliability for medium to high frequency applications in automotive, energy, industrial, and telecom systems. Offering four and six MOSFETs, respectively, in the low profile MAACPAK PressFit package, the Vishay Semiconductor VS-MPY038P120 and VS-MPX075P120 combine the latest silicon carbide (SiC) technology with a rugged transfer mold construction. The power modules integrate the latest generation of Vishay SiC MOSFETs with an NTC thermistor for temperature sensing and fast intrinsic SiC diodes with low reverse recovery. The result is reduced switching losses and increased efficiency. For increased reliability, the rugged transfer mold technology of the VS-MPY038P120 and VS-MPX075P120 allows them to achieve much longer product lifecycles than legacy solutions available on the market, while improving thermal resistance. For more efficient, cleaner switching, the devices’ low profile helps reduce parasitic inductance and EMI, while saving space. The modules’ PressFit pins are arranged in a matrix that adheres to industry-standard layouts, allowing for easy replacement of competing solutions in existing designs to enhance performance.