Surface-Mount Heat Sinks

The Boyd line of low profile surface-mount heat sinks is suitable for SMT power semiconductor devices in D-PAK, D²PAK, D³PAK, and SO-10 packages. Their unique design removes heat indirectly through conduction without making contact with the SMT device like traditional through-hole solutions.

The semiconductor's conventional copper drain pad is modified to extend beyond the edges of the semiconductor package, providing space to mount the heat sink. The device and heat sink are soldered directly to the modified drain pad, creating a thermal transfer path from the package tab to the surface-mount heat sink. In addition, the elevated "wings" of the heat sink provide ample surface area to dissipate the heat into the surrounding environment.