ulTIMiFlux Thermal Interface Material

Wakefield Thermal ulTIMiFlux thermal interface materials offer high performance, low cost, configurability, and custom sizes for thermal system needs. Thermal interface materials (TIM) are secondary materials installed between the heatsink and the device, which are designed to improve the thermal transfer to the heatsink. Regardless of how flat or smooth the device and heat-sink are, there will always be small air voids between the two surfaces. Since air is not a great conductor of heat, a TIM replaces the air and fills the voids. There are many types of TIMs, and each has its best usage cases. Wakefield Thermal thermal-gap-filling pads are intended to fill a large void between a device and the heatsink. A gap pad is a compressible material most commonly used when there are multiple devices to be contacted to the heatsink, but all the different device heights make it difficult to use a thin material. These materials come in a variety of thicknesses, conductivities, and durometers to meet a wide range of needs. This series of TIM includes sheets, die-cut pads, gels, and two-part dispensable materials.