Sustainability-At-A-Glance

Our 2030+ Sustainability Ambition Framework sets the frame for our global sustainability strategy, with clear ambitions and targets that we want to achieve in this decade.

Image of Bergquist's SIL PAD® TSP 3500 SIL PAD® TSP 3500 תאריך פרסום: 2024-04-11

Bergquist's SIL PAD TSP 3500 is a silicone elastomer formulated to maximize the dielectric and thermal performance.

Image of Bergquist's GAP FILLER TGF 3600 GAP FILLER TGF 3600 תאריך פרסום: 2024-04-11

Bergquist's GAP FILLER TGF 3600 is a two-component, liquid gap-filling material featuring ultra-high thermal performance.

Image of Bergquist logo Bergquist / Henkel

חברת Bergquist היא המפתחת והיצרנית המובילה בעולם של חומרים לניהול תרמי הכוללים ®Sil-Pad‏, מבדדים מוליכים תרמית ומגוון של חומרים מיוחדים: ®Gap Pad‏, חומרים ממלאי מרווחים, ®Hi-Flow‏, חומרים משני פאזה, ®Softface‏ ו- ®Bond-Ply‏.

c

Thermal management of power electronics, whether power supplies or power components, requires interfacing the package to a heat sink using a thermal interface material (TIM).

Thermal Management Solutions for Industrial Automation & Power Conversion

Advanced communication technologies, motor controls, drives and power converters are delivering more function in smaller form factors, which raises power densities and increases heat generation.

Image of Bergquist's Gap Pad® TGP 6000ULM Gap Pad® TGP 6000ULM תאריך פרסום: 2020-04-16

Bergquist’s Gap Pad® TGP 6000ULM silicone-based, nonelectrically conductive Gap Pad is highly conformable, providing excellent coverage on various topographies.

Image of Bergquist's Gap Pad® TGP 7000 Gap Pad® TGP 7000ULM תאריך פרסום: 2020-04-08

Bergquist’s Gap Pad® TGP 7000ULM soft gap-filling material is rated at 7.0 W/m-K and formulated for high-performance applications requiring low assembly stress.

Image of  LOCTITE® STYCAST 2850FT Thermally Conductive Epoxy Encapsulant STYCAST 2850FT Thermally Conductive Epoxy Encapsulant תאריך פרסום: 2020-01-02

LOCTITE STYCAST 2850FT thermally conductive epoxy encapsulant is designed to encapsulate components requiring heat dissipation and thermal shock properties.

GAP PAD®, SIL PAD®, & HI-FLOW Ordering Information

GAP PAD®, SIL PAD®, & HI-FLOW Ordering Information

Integration of Bergquist Systems into Henkel SAP Systems

As you are aware, Henkel acquired The Bergquist Company in late 2014. Since then, Henkel has been integrating the Bergquist organization and analyzing the parallel IT systems in an effort to create minimal disruption once the IT systems are brought together

Image of Henkel Bergquist's Gap Pad HC 5.0 Gap Pad HC 5.0 תאריך פרסום: 2016-08-11

A soft and compliant gap filling material, Bergquist's Gap Pad HC 5.0 has a thermal conductivity of 5.0 W/m-K and delivers outstanding thermal performance with very low compression stress.

Gap Pad EMI 1.0 Gap Pad EMI 1 תאריך פרסום: 2015-11-16

Explore potential markets and applications for the Bergquist Gap Pad EMI 1.0 product.

Duration: 15 minutes
Liquid Dispensed TIM

This animation demonstrates how to combine your Thermal Clad® IMS with Bergquist Liquid Dispensed TIM for an optimal thermal solution.

Video Library | Henkel LOCTITE® Bergquist®
Thermal Interface Material Gap Pad Thermal Interface Material (TIM), Gap Pad® VO Ultra Soft תאריך פרסום: 2014-02-18

Gap Pad VO offers a thermally conductive, electrically isolating material with a wide array of secondary benefits.

Duration: 5 minutes
Thermal Interface Materials Gap Pad Characteristics Thermal Interface materials (TIM) Gap Pad Key Product Characteristics תאריך פרסום: 2013-11-04

Thermal interface materials (TIM) Gap Pad characteristics including thermal, electrical, and mechanical.

Duration: 15 minutes
Image of Bergquist's Sil-Pad® 900S Sil-Pad® 900S תאריך פרסום: 2013-10-07

חומר הבידוד Sil-Pad® 900S הוא בעל עכבה תרמית של (0.61°C-in2/W (@50 psi עבור יישומים הכוללים ספקי-כוח.

Image of Bergquist's Q-Pad® 3 Q-Pad® 3 תאריך פרסום: 2013-10-07

ה- Q-Pad® 3 המחוזק בזכוכית והמשמש כתחליף לגריז ניתן להתקנה לפני ההלחמה והניקוי.

Image of Bergquist's Gap Pad® 1500 Gap Pad® 1500 תאריך פרסום: 2013-10-07

החומר למילוי מרווחים הלא-מחוזק Gap Pad® 1500 הוא בעל מוליכות תרמית של W/m-K ‏1.5 וקשיות נמוכה ונוחה.

Image of Bergquist's Sil-Pad® K-10 Sil-Pad® K-10 תאריך פרסום: 2013-10-07

מבודד מבוסס ®Kapton ‏Sil-Pad® K-10 מציעה תכונות בידוד טובות וביצועים תרמיים מצויינים.