Solutions That Mitigate EMI and Help Reduce Noise and Vibration

Electronic printed circuit board (PCB) assemblies often face a dual challenge: managing mechanical stress while also controlling electromagnetic interference. By combining 3M conductive pressure-sensitive adhesives with 3M Bumpon™ protective products resilient rollstock, designers and manufacturers can address both challenges at once. Bumpon products help protect sensitive PCB components through vibration damping, spacing, and improved airflow, while conductive pressure-sensitive adhesives deliver reliable EMI grounding and shielding. Together, these solutions help reduce mechanical and electromagnetic noise, supporting more robust performance, improved reliability, and longer-lasting electronic devices.

3M Electrically Conductive Adhesive Transfer Tapes 9703 and 9713 are designed for EMI shielding and grounding in electronic assemblies. Both use pressure-sensitive adhesives for ease of application and can be converted into custom shapes. 3M tape 9703 provides Z-axis-only conductivity with low outgassing for applications requiring tight interconnect control without lateral shorts, especially in aerospace and defense. 3M tape 9713 offers isotropic XYZ-axis conductivity with a nickel-plated carbon-fiber scrim, providing balanced adhesion and conductivity for larger contact areas and broad electronics applications.

3M Bumpon Resilient Rollstock SJ5816, SJ5632, and SJ5832 are made of a rubber bumper material and designed for use as feet, stops, and spacers, offering reliable protection and performance in a versatile rollstock format for die-cutting across various thickness needs.

*"Halogen-free" is defined as having 900 ppm bromine max, 900 ppm chlorine max, and 1,500 ppm total bromine and chlorine max, per IEC 61249-2-21. **EU RoHS This product does not exceed the maximum concentration values (MCVs) set under EU Directive 2011/65/EU (RoHS recast/RoHS 2), as stated in Annex II to that directive. This means that each of the homogenous materials within this product does not exceed the following MCVs: (a) 0.1% (by weight) for lead, mercury, hexavalent chromium, polybrominated biphenyls, or polybrominated diphenyl ethers; and (b) 0.01% (by weight) for cadmium.